Learning Hub
Wednesday, March 25, 2026
14:00:00
- 14:15:00
Connected Microscopy and AI: Improving Materials Characterization and Analysis
- HUB 4
Explore how advancements in AI and Machine Learning are transforming microscopy-based image segmentation and materials characterization, enabling faster, standardized, and more accurate analysis of complex microstructures in batteries, electronics, alloys, and more. This presentation will highlight practical examples of AI-driven and connected workflows that enhance image processing, segmentation, and classification across optical, electron, and x-ray microscopy, delivering actionable insights to streamline processes and improve manufacturing quality.
Trevor Campbell
Sales Development Manager - Microscopy
ZEISS Industrial Quality Solutions
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